D-Tools has introduced Interconnect Diagrams in D-Tools Cloud, providing integrators with an interactive, visual way to design and document device connections with complete accuracy.
The new feature allows system designers to map out signal flow and wire connections on a dynamic canvas that is always in sync with the project’s bill of materials (BOM). This ensures that every team member, from sales to installation, is working with the same up-to-date information.
“Interconnect Diagrams represent the next step in accurately representing a system design and creates a communication platform around which team members gain a common understanding of a system’s design intent,” says Randy Stearns, CEO of D-Tools.
Transforming System Design and Delivery
Interconnect Diagrams aim to change how integrators visualise, coordinate, and execute projects. With quotes and device connections automatically synchronised, teams can collaborate more effectively, reduce errors, and ensure projects are delivered exactly as designed.
The feature is fully embedded within D-Tools Cloud, requiring no additional setup or third-party software. Teams can connect devices directly from the platform’s Product Library, streamlining communication and project execution from proposal through to installation.
Key Features
- Interactive Diagram Canvas – Connect devices using an intuitive click-to-connect interface.
- Flexible Layouts – Filter by system, phase, or location for clear visibility.
- Catalog Sync – Connections remain linked to live product and BOM data.
- Connection Summary Report – Instantly generate documentation for field teams.
- Dynamic Grouping and Filters – Quickly locate and organise devices within any project.
Benefits
- Clarity – Replace scattered notes and drawings with a single, accurate visual reference.
- Efficiency – Eliminate redundant documentation and accelerate system design.
- Alignment – Keep all stakeholders working from a single, real-time data source.
- Confidence – Ensure systems are installed as designed, improving field accuracy and efficiency.

